• HOME
  • About Journal
    • Historical evolution
    • Journal Honors
  • Editorial Board
    • Members of Committee
    • Director of the Committee
    • President and Editor in chief
  • Submission Guide
    • Instructions for Authors
    • Manuscript Processing Flow
    • Model Text
    • Procedures for Submission
  • Academic Influence
  • Open Access
  • Ethics&Policies
    • Publication Ethics Statement
    • Peer Review Process
    • Academic Misconduct Identification and Treatment
    • Advertising and Marketing
    • Correction and Retraction
    • Conflict of Interest
    • Authorship & Copyright
  • Contact Us
  • Chinese
Site search        
文章摘要
基于键合图的飞跨电容型逆变器故障诊断研究
Fault Diagnosis of Flying Capacitor Inverter Based on Bond Graph
Received:June 22, 2015  Revised:October 10, 2015
DOI:
中文关键词: 飞跨电容型逆变器  键合图  全局解析冗余关系  参数性故障
英文关键词: flying  capacitor inverter, bond  graph, global  analytical redundancy  relation, parametric  fault
基金项目:国家自然科学基金资助项目(61364010)
Author NameAffiliationE-mail
Zhang Xinyang* College of Electrical Engineering,Xinjiang University,Xinjiang Urumqi 830047 249313859@qq.com 
Pazilai Mahemuti China.  
Hits: 1713
Download times: 660
中文摘要:
      通过分析飞跨电容型逆变器的结构及特点,对逆变器的参数性故障进行诊断,并采用基于键合图模型的全局解析冗余关系法对参数性故障的检测和定位进行了研究。根据键合图理论建立了飞跨电容型逆变器的键合图模型,通过在键合图模型中加入观测信号和虚拟传感器的方法建立了系统的诊断键合图模型,从而得到系统的全局解析冗余关系。最后,利用20-sim仿真平台进行仿真分析,验证了基于键合图模型的全局解析冗余关系方法在参数性故障诊断方面的可行性。
英文摘要:
      Based on analyzing structure and characteristic of flying capacitor inverter, in order to diagnose parametric fault of inverter. With global analytical redundancy relation method based on bond graph model carry out detection and localization of the parametric fault. According to bond graph theory established the bond graph model of flying capacitor inverter, through the way of adding observation signal and virtual sensor to bond graph model to establish the diagnosis bond graph model of system, thus getting the global analytical redundancy relation of system. Finally, using 20-sim simulation platform to simulation and analysis, and verifying the global analytical redundancy relationship based on bond graph model is feasible in the aspect of parametric fault diagnosis.
View Full Text   View/Add Comment  Download reader
Close
  • Home
  • About Journal
    • Historical evolution
    • Journal Honors
  • Editorial Board
    • Members of Committee
    • Director of the Committee
    • President and Editor in chief
  • Submission Guide
    • Instructions for Authors
    • Manuscript Processing Flow
    • Model Text
    • Procedures for Submission
  • Academic Influence
  • Open Access
  • Ethics&Policies
    • Publication Ethics Statement
    • Peer Review Process
    • Academic Misconduct Identification and Treatment
    • Advertising and Marketing
    • Correction and Retraction
    • Conflict of Interest
    • Authorship & Copyright
  • Contact Us
  • 中文页面
Address: No.2000, Chuangxin Road, Songbei District, Harbin, China    Zip code: 150028
E-mail: dcyb@vip.163.com    Telephone: 0451-86611021
© 2012 Electrical Measurement & Instrumentation
黑ICP备11006624号-1
Support:Beijing Qinyun Technology Development Co., Ltd