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文章摘要
IGBT结温获取方法及其讨论*
Review of IGBT Junction Temperature Acquisition method
Received:April 26, 2016  Revised:April 26, 2016
DOI:
中文关键词: IGBT  结温  模拟法  探测法
英文关键词: IGBT  junction temperature  simulation method  detection method
基金项目:国家科技支撑计划(2015BAA09B01);国家自然科学基金项目51377044;河北省科技计划项目(13214303D,14214503D)
Author NameAffiliationE-mail
YAO Fang School of Electrical Engineering,Hebei University of Technology yaofang@hebut.edu.cn 
WANG Shaojie* School of Electrical Engineering,Hebei University of Technology 1350253647@qq.com 
LI Zhigang School of Electrical Engineering,Hebei University of Technology zgli@hebut.edu.cn 
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中文摘要:
      IGBT模块的寿命预测研究与可靠性分析等都与结温有密切的关系,因此研究结温的获取方法是研究IGBT模块可靠性的基础。本文将IGBT模块的结温获取方法分为了两大类,分别为结温模拟法与结温探测法,结温模拟法主要是对IGBT进行建模进而计算其结温,结温探测法是对IGBT模块的结温进行实时测量。本文分别对两大类结温获取方法进行了分析,根据各种方法的特点分别将其归类并进行阐述,并对比分析了各方法的优缺点,给出了适用范围。最后指出了结温探测的发展趋势以及需要解决的关键问题,以促进该领域的进一步发展。
英文摘要:
      Life prediction and reliability analysis of IGBT modules has a close relationship with junction temperature, so the acquisition method of IGBT junction temperature is the basis to enhance the reliability of IGBT modules. In this paper, the IGBT junction temperature acquisition method is divided into simulation method and detection method. Junction temperature simulation method is setting up IGBT models first and then computing the junction temperature, detection method is measuring the junction temperature of IGBT in real time. This paper analyses the two categories junction temperature acquisition method, classifies all the measurement methods by their characteristics and expounds respectively, and then describes their advantages and disadvantages, as well as the range of application. At last, this paper points out the trend of measurement and the key issues to be solved, to promote the further development of the field.
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