More and more attentions are paid to the heat dissipation problem of Power electronic devices IGBT since it has been the bottleneck in the development of integrated large capacitors. This paper presents an experiment in which two kinds of IGBT module cold plates are designed, one normal and the other with heat transfer enhancement respectively. The temperature distributions of the two kinds of cold plates were simulated numerically，and the performances also turned out by using self-built experimental platform. The two kinds of different structural cold plates could satisfy the requirements of the power device junction temperature, and which of the heat transfer enhancement cold plates showed lower temperature with more uniform temperature distribution. In the power of 3000W and 4000W, the temperature of cold plates read 56.6℃ and 59.5℃ and provided guidance for system structure design.